Products - Sapphire Wafer Back Grinding Wheels for Thinning and Fine Grinding

Sapphire Wafer Back Grinding Wheels are mainly used for the thinning and fine grinding of the silicon wafer. The Grinding-wheels for LED Substrate, Silicon Wafer, Sapphire Wafer are mainly used for Back Thinning of Sapphire Epitaxial Wafer, Silicon Wafer, Gallium Arsenide and GaN Wafer.

YingLong Produce Diamond Vitrified Grinding-wheels and Export such Grinding-wheels to many countried.

Commondity: Diamond Back Thinning Grinding-wheels, Back Thinning Grinding-wheels, Diamond Vitrified Grinding-wheels, Back Grinding-wheels, Diamond Back Grinding-wheels;

Application: Cut & Grind Single Crystal Silicon, Cut Gallium Arsenide, Cut & Grind Sapphire Substrate, Cut & Grind LED substrate, Cut & Grind Sapphire wafer, Cut & Grind Sapphire Chips; Cut & Grind Sapphire Igots, Cut & Grind Silicon Wafer;

Material: Diamond;

Bond: Vitrified Binder;

Dimensions: Under Customers' Requirement.

Category ListCategory List 
grind sapphire
grind sapphire
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cut sapphire chips
cut sapphire ch...
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grind sapphire substrate
grind sapphire ...
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Diamond Grinding Wheels for Sapphire Wafer Industry
Diamond Grindin...
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Diamond Grinding Wheels
Diamond Grindin...
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Diamond Grinding Wheels
Diamond Grindin...
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Vitrified Grinding Wheels
Vitrified Grind...
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Diamond Grinding Stones
Diamond Grindin...
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cut sapphire wafer
cut sapphire wa...
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Diamond Grinding Disc
Diamond Grindin...
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Grinding Disc
Grinding Disc
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Abrasive Stones
Abrasive Stones
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Diamond Grinding stones
Diamond Grindin...
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Vitrified grinding stones
Vitrified grind...
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vitrified binder
vitrified binde...
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Grind Sapphire Wafer
Grind Sapphire ...
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Sapphire wafer grinding
Sapphire wafer ...
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Grinding Sapphire Chips
Grinding Sapphi...
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Cutting Sapphire Substrate
Cutting Sapphir...
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